Semiconductor

Micro-vibrations – Revealing hidden risks
Even the slightest micro-vibrations during chip production can lead to defects or deviations that significantly impair the quality (yield) of your products. Using high-resolution multi-body, and structural analyses, we identify critical vibration patterns, and develop efficient solutions before failures occur.

Efficient cooling – Thermal control at the nanoscale
The thermal loads acting on the equipment and wafer during lithography, coating, and etching processes are substantial. Our thermal simulations enable precise modeling of cooling in the manufacturing process – including analysis of convective flows, and heat transfer in complex geometries. This ensures that the systems always maintain the optimum operating temperature.

Thermomechanical analysis – Controlling deformation
Heating causes expansion, which is a critical factor in the manufacture of extremely fine structures. We use thermomechanical analyses to examine how materials deform under the influence of temperature. This allows us to coordinate tolerances at an early stage, thereby improving quality.

Acoustic coupling – Understanding fluid-structure interactions
In semiconductor production, mechanical structures often come into contact with liquids, for example during cleaning or cooling processes. We analyze the acoustic coupling between structures and liquids in order to avoid undesirable resonance effects and increase process stability.